US 12,233,621 B2
Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil
Yuki Kitai, Osaka (JP); Masashi Koda, Fukushima (JP); Yasunori Hoshino, Osaka (JP); Atsushi Wada, Osaka (JP); and Mikio Sato, Fukushima (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/609,695
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
PCT Filed May 14, 2020, PCT No. PCT/JP2020/019351
§ 371(c)(1), (2) Date Nov. 8, 2021,
PCT Pub. No. WO2020/230870, PCT Pub. Date Nov. 19, 2020.
Claims priority of application No. 2019-092354 (JP), filed on May 15, 2019.
Prior Publication US 2022/0220272 A1, Jul. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 15/08 (2006.01); C08J 7/06 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01)
CPC B32B 15/08 (2013.01) [C08J 7/06 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 3/022 (2013.01); B32B 2457/08 (2013.01); C08J 2325/06 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/125 (2013.01); H05K 2203/1377 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A copper clad laminate comprising:
an insulating layer containing a cured product of a resin composition; and
a surface treated copper foil on one surface or both surfaces of the insulating layer, wherein
the resin composition contains a polymer having a structural unit represented by the following Formula (1) in a molecule:

OG Complex Work Unit Chemistry
wherein in Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, the resin composition further contains a modified polyphenylene ether compound having a terminal modified with the following Formula (5) or (6):

OG Complex Work Unit Chemistry
wherein in Formula (5), s represents an integer 0 to 10, Z represents an arylene group, and R12 to R14 each independently represent a hydrogen atom or an alkyl group,

OG Complex Work Unit Chemistry
wherein in Formula (6), R15 represents a hydrogen atom or an alkyl group; and
the surface treated copper foil includes a finely roughened particle treatment layer of copper on at least one surface side of a copper foil, wherein
the finely roughened particle treatment layer is formed of fine copper particles having a particle size of 40 to 200 nm,
a heat resistance treatment layer containing nickel is provided on the finely roughened particle treatment layer,
a rust prevention treatment layer containing at least chromium is provided on the heat resistance treatment layer,
a silane coupling agent treatment layer is provided on the rust prevention treatment layer, and
an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.