US 12,233,505 B2
Polishing system with capacitive shear sensor
Nicholas A. Wiswell, Sunnyvale, CA (US); Chih Chung Chou, San Jose, CA (US); and Dominic J. Benvegnu, La Honda, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 10, 2023, as Appl. No. 18/315,467.
Application 18/315,467 is a division of application No. 16/522,287, filed on Jul. 25, 2019, granted, now 11,660,722.
Claims priority of provisional application 62/726,122, filed on Aug. 31, 2018.
Prior Publication US 2023/0278164 A1, Sep. 7, 2023
Int. Cl. B24B 49/12 (2006.01); B24B 37/013 (2012.01); B24B 37/04 (2012.01)
CPC B24B 49/12 (2013.01) [B24B 37/013 (2013.01); B24B 37/042 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A polishing pad, comprising:
a polishing layer having a polishing surface;
a backing layer supporting the polishing layer;
a sensor assembly including i) a pair of vertically-separated laterally-extending parallel electrodes having a compressible gap therebetween to provide a capacitive pressure sensor positioned in an aperture in the backing layer and secured to the polishing pad, and ii) a pad portion supported on the capacitive pressure sensor and having a top surface coplanar with the polishing surface, wherein the pad portion comprises an upwardly-extending projection that is laterally offset relative to the pair of parallel electrodes.