US 12,233,501 B2
Substrate support device
Sang-Jean Jeon, Yongin-si (KR); and Hyun-Sang Hwang, Yongin-si (KR)
Assigned to TES CO., LTD, Yongin-si (KR)
Filed by TES Co., Ltd, Yongin-si (KR)
Filed on Feb. 17, 2023, as Appl. No. 18/111,228.
Claims priority of application No. 10-2022-0020793 (KR), filed on Feb. 17, 2022; and application No. 10-2023-0005429 (KR), filed on Jan. 13, 2023.
Prior Publication US 2023/0256551 A1, Aug. 17, 2023
Int. Cl. H01J 37/00 (2006.01); B23Q 3/154 (2006.01); H01J 37/32 (2006.01)
CPC B23Q 3/154 (2013.01) [H01J 37/32532 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 37/32697 (2013.01); H01J 37/32715 (2013.01); H01J 2237/332 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate support device comprising:
a substrate support part on which a wafer is deposited, the substrate support part comprising a first mesh electrode and a second mesh electrode disposed under the first mesh electrode;
a chucking circuit configured to apply a DC voltage to the first mesh electrode; and
an edge control circuit configured to control timings of operations related to the first mesh electrode and the second mesh electrode and control RF (Radio Frequency),
wherein the second mesh electrode is divided into a plurality of second sub-mesh electrode to remove an induced electromotive force generated due to a closed loop.