US 12,233,477 B2
Hermetic assembly and device including same
David A. Ruben, Mesa, AZ (US); Andreas Fenner, Chandler, AZ (US); Andrew J. Ries, Lino Lakes, MN (US); Robert A Munoz, Andover, MN (US); Christopher T. Kinsey, Bethel, MN (US); and Mark E. Henschel, Phoenix, AZ (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by MEDTRONIC, INC., Minneapolis, MN (US)
Filed on Jan. 5, 2024, as Appl. No. 18/404,992.
Application 18/404,992 is a continuation of application No. 17/118,283, filed on Dec. 10, 2020, granted, now 11,865,639.
Claims priority of provisional application 62/947,924, filed on Dec. 13, 2019.
Prior Publication US 2024/0131625 A1, Apr. 25, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 26/20 (2014.01); A61N 1/375 (2006.01); A61N 1/39 (2006.01); B23K 26/32 (2014.01)
CPC B23K 26/206 (2013.01) [A61N 1/3754 (2013.01); A61N 1/3968 (2013.01); B23K 26/32 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A hermetic assembly comprising:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
 
9. An implantable medical device comprising a hermetically-sealed package, wherein the package comprises:
a housing; and
a hermetic assembly comprising:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate;
wherein an edge of the body of the ferrule is connected to an edge of the housing.
 
18. A hermetically-sealed package comprising a first hermetic assembly and a second hermetic assembly connected to the first hermetic assembly, wherein each of the first hermetic assembly and second hermetic assembly comprises:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.