| CPC B22F 7/064 (2013.01) [B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/0551 (2022.01); B22F 1/056 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 1/147 (2022.01); B23K 20/02 (2013.01); B23K 20/22 (2013.01); H01L 24/83 (2013.01)] | 7 Claims |
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1. A composition for pressure bonding, comprising:
a copper powder;
a solid reducing agent; and
a liquid medium having a boiling point of less than 300° C. at 1 atm,
wherein the solid reducing agent has a chemical structure having at least one amino group and a plurality of hydroxyl groups,
a content ratio of the solid reducing agent is 0.1 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the copper powder,
the composition has a viscosity of 20 Pa·s to 200 Pa·s at a shear rate of 10 s−1 and 25° C., and
the composition has a compressibility of 10% to 90%, the compressibility being expressed by:
Compressibility (%)=((A−B)/A)×100,
wherein A represents a thickness of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes, and
B represents a thickness of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes.
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