US 12,233,460 B2
Copper paste, wick formation method, and heat pipe
Hideo Nakako, Tokyo (JP); Toshiaki Tanaka, Tokyo (JP); Dai Ishikawa, Tokyo (JP); Yoshinori Ejiri, Tokyo (JP); and Michiko Natori, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Appl. No. 18/026,244
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Sep. 16, 2021, PCT No. PCT/JP2021/034090
§ 371(c)(1), (2) Date Mar. 14, 2023,
PCT Pub. No. WO2022/059733, PCT Pub. Date Mar. 24, 2022.
Claims priority of application No. 2020-156581 (JP), filed on Sep. 17, 2020.
Prior Publication US 2023/0356294 A1, Nov. 9, 2023
Int. Cl. B22F 3/10 (2006.01); B22F 1/12 (2022.01); F28D 15/04 (2006.01)
CPC B22F 3/1035 (2013.01) [B22F 1/12 (2022.01); F28D 15/046 (2013.01); B22F 2301/10 (2013.01); B22F 2304/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A copper paste for forming a wick of a heat pipe, the copper paste comprising:
copper particles;
thermally decomposable resin particles comprising a thermally decomposable resin A;
a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles; and
a thermally decomposable resin B that is soluble in the dispersion medium.