US 11,910,715 B2
Method and apparatus for poling polymer thin films
Albert Ting, San Jose, CA (US); Hongwei Lu, Jiaxing (CN); and Kai-An Wang, Cupertino, CA (US)
Assigned to CREESENSE MICROSYSTEMS INC., Suzhou (CN)
Filed by CREESENSE MICROSYSTEMS INC., Suzhou (CN)
Filed on Aug. 11, 2021, as Appl. No. 17/400,039.
Application 17/400,039 is a division of application No. 16/865,412, filed on May 3, 2020, granted, now 11,283,004.
Application 16/865,412 is a continuation in part of application No. 16/728,472, filed on Dec. 27, 2019, granted, now 11,282,729.
Claims priority of provisional application 62/785,665, filed on Dec. 27, 2018.
Claims priority of application No. 201910308554.0 (CN), filed on Apr. 17, 2019; application No. 201910308956.0 (CN), filed on Apr. 17, 2019; application No. 201910308975.3 (CN), filed on Apr. 17, 2019; application No. 201920521155.8 (CN), filed on Apr. 17, 2019; application No. 201920521158.1 (CN), filed on Apr. 17, 2019; and application No. 201920521676.3 (CN), filed on Apr. 17, 2019.
Prior Publication US 2021/0376223 A1, Dec. 2, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H10N 30/045 (2023.01); H01J 37/32 (2006.01); H10N 30/857 (2023.01)
CPC H10N 30/045 (2023.02) [H01J 37/32568 (2013.01); H01J 37/32715 (2013.01); H01J 2237/20228 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/336 (2013.01); H10N 30/857 (2023.02)] 3 Claims
OG exemplary drawing
 
1. A workpiece to be polarized, comprising:
a base plate;
an electrode layer formed on a surface of the base plate, including a plurality of grounding electrodes and one or more grounding pads, the grounding pads being located at edges of the base plate, each grounding electrode being electrically connected to at least one of the grounding pads, the plurality of grounding electrodes being spatially separate from each other; and
a polymer thin film formed on the base plate over a portion of the electrode layer, the polymer thin film including a plurality of spatially separate thin film areas, each thin film area covering one of the plurality of grounding electrodes, the thin film leaving the grounding pads uncovered.