US 11,910,578 B2
Vehicle electronics cooling systems and methods
Vagner Pascualinotto Junior, Rochester Hills, MI (US); Harald Kreidner, Hann. Muenden (DE); and Ilja Makarenko, Vellmar (DE)
Assigned to ContiTech Techno-Chemie GmbH, Karben (DE)
Filed by ContiTech Techno-Chemie GmbH, Karben (DE)
Filed on Sep. 23, 2021, as Appl. No. 17/448,690.
Prior Publication US 2023/0089178 A1, Mar. 23, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20872 (2013.01) 12 Claims
OG exemplary drawing
 
1. A hybrid thermal management system for electronics, the system comprising:
a bottom piece being injection molded and comprised of polymer, the bottom piece comprising a plurality of coolant channels, an input port and an output port;
a thermal plate covering the bottom piece and the plurality of coolant channels, comprised of metal and configured to dissipate thermal energy from a computing device to a coolant within the plurality of coolant channels;
the thermal plate comprising a plurality of layers of thermally conductive material including aluminum;
the thermal plate is not injection molded;
an overmold comprised of die cast aluminum and attached to the thermal plate and the bottom piece;
the input port configured to supply the coolant to the plurality of coolant channels; and
the output port configured to collect the coolant from the plurality of coolant channels and convey thermal energy away from the system.