US 11,910,571 B2
Housing parts, housings and processes for preparing the same
Guanghui Wu, Shanghai (CN); Fan Yang, Shanghai (CN); and Ke Hong, Shanghai (CN)
Assigned to Covestro Intellectual Property GmbH & Co. KG, Leverkusen (DE)
Appl. No. 17/626,400
Filed by COVESTRO INTELLECTUAL PROPERTY GMBH & CO. KG, Leverkusen (DE)
PCT Filed Jul. 13, 2020, PCT No. PCT/EP2020/069718
§ 371(c)(1), (2) Date Jan. 11, 2022,
PCT Pub. No. WO2021/009103, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. PCT/CN2019/095963 (WO), filed on Jul. 15, 2019; and application No. 19191877 (EP), filed on Aug. 15, 2019.
Prior Publication US 2022/0264762 A1, Aug. 18, 2022
Int. Cl. H05K 7/20 (2006.01); B29C 45/00 (2006.01); B29C 45/16 (2006.01); C08L 69/00 (2006.01); B29K 69/00 (2006.01); B29L 31/18 (2006.01)
CPC H05K 7/2039 (2013.01) [B29C 45/0001 (2013.01); B29C 45/16 (2013.01); C08L 69/00 (2013.01); B29K 2069/00 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/18 (2013.01); C08L 2205/02 (2013.01); C08L 2207/04 (2013.01); C08L 2666/70 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A housing part comprising
a first layer, said first layer being molded from a first composition comprising a1) 50-90 wt. % of a first amorphous polymer and b1) 10-50 wt. % of a first thermally conductive filler, the first composition having a thermal conductivity (TC1) of 4-40 W/(m*K),
a second layer, said second layer being molded from a second composition comprising a2) 50-90 wt. % of a second amorphous polymer and b2) 10-50 wt. % of a second thermally conductive filler, the second composition having a thermal conductivity (TC2) of 0.5-10 W/(m*K), and the second layer being molded over the first layer by leaving at least one area of the first layer not being over-molded with the second layer for being exposed to at least one heat source,
wherein, TC1 is at least 2 W/(m*K) larger than TC2, the amounts of al and b1 are based on the total weight of the first composition, the amounts of a2 and b2 are based on the total weight of the second composition, and the thermal conductivity is measured in-plane according to ASTM E1461-01.