US 11,910,568 B2
Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components
Joel Richard Goergen, Soulsbyville, CA (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed on Oct. 28, 2020, as Appl. No. 17/083,152.
Claims priority of provisional application 63/012,830, filed on Apr. 20, 2020.
Prior Publication US 2021/0329810 A1, Oct. 21, 2021
Int. Cl. H05K 7/20 (2006.01); H01L 23/427 (2006.01); G02B 6/12 (2006.01); B81B 7/00 (2006.01)
CPC H05K 7/2039 (2013.01) [G02B 6/12 (2013.01); H01L 23/427 (2013.01); B81B 7/008 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01)] 28 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a substrate and die package;
a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through a first surface of the thermal transfer plate to a second surface of the thermal transfer plate for transmitting power from a power module to the substrate and die package, and wherein at least one optical path extends through the substrate and die package, and extends from the first surface of the thermal transfer plate to the second surface of the thermal transfer plate; and
a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.