	US 11,910,566 B1
	Processor heat exchanger with separate mounting structure
Luke Thomas Gregory, Mercer Island, WA (US); Darin Lee Frink, Lake Tapps, WA (US); Rick Chun Kit Cheung, Lynwood, WA (US); Nafea Bshara, Cupertino, CA (US); Kenny Kiet Huynh, Bothell, WA (US); Noah Kelly, Kingston, WA (US); Priti Choudhary, Seattle, WA (US); and Ali Elashri, Seattle, WA (US)
Assigned to Amazon Technologies, Inc., Seattle, WA (US)
Filed by Amazon Technologies, Inc., Seattle, WA (US)
Filed on Mar. 18, 2021, as Appl. No. 17/206,023.
Int. Cl. H01L 23/40 (2006.01); H05K 7/20 (2006.01)

CPC H05K 7/20281 (2013.01) [H05K 7/2039 (2013.01); H05K 7/20263 (2013.01)]

21 Claims

1. A method, comprising:

providing a heat exchanger for removing heat from a selected processor or a selected processor package selected from a plurality of different types of processors or different processor packages, wherein the heat exchanger comprises:

a surface configured to be positioned proximate to a surface of a package of the processor such that waste heat from the processor is conducted to the heat exchanger;

a heat transfer portion configured to transfer at least a portion of the heat conducted to the heat exchanger from the processor to a cooling fluid in fluid communication with the heat exchanger; and

mounting flanges extending out from respective sides of the heat exchanger,

wherein the mounting flanges are configured to engage with a mounting structure for coupling the heat exchanger to the selected processor or the selected processor package;

selecting the mounting structure for the heat exchanger from different mounting structures with which the mounting flanges of the heat exchanger are configured to engage, wherein:

respective ones of the different mounting structures have different lengths, widths, or bolt patterns;

the different types of processors or the different processor packages require different complementary mounting structures having the different lengths, widths, or bolt patterns to mount the heat exchanger to the different types of processors or the different processor packages, via a set of fasteners, wherein the heat exchanger is configured to be mounted on any of the different types of processors or the different processor packages via the different mounting structures with which the mounting flanges of the heat exchanger are configured to engage; and

the mounting flanges of the heat exchanger comprise open corners and center openings configured to accommodate passage of respective fasteners of the set of fasteners laid out according to the different lengths, widths, or bolt patterns of the selected mounting structure; and

coupling the heat exchanger with the selected processor or the selected processor package via the selected mounting structure that complements mounting hardware of the selected processor or the selected processor package.

7. A heat exchanger for removing waste heat from a selected processor or a selected processor package selected from a plurality of different types of processors or different processor packages, the heat exchanger comprising:

a surface configured to be positioned proximate to a surface of a package of the selected processor or the selected processor package such that waste heat from the selected processor or the selected processor package is conducted to the heat exchanger;

a heat transfer portion configured to transfer at least a portion of the heat conducted to the heat exchanger from the selected processor or the selected processor package to a cooling fluid in fluid communication with the heat exchanger; and

mounting flanges extending out from respective sides of the heat exchanger; wherein:

the heat exchanger is configured to be mounted on any of a plurality of the different types of processors or the different processor packages via different mounting structures with which the mounting flanges of the heat exchanger are configured to engage;

respective ones of the different mounting structures have different lengths, widths, or bolt patterns; and

the mounting flanges of the heat exchanger comprise open corners and center openings configured to accommodate passage of respective ones of a set of fasteners laid out according to the different lengths, widths, or bolt patterns.

14. A mounting assembly for mounting a heat exchanger to a processor, the mounting assembly comprising:

a mounting bracket configured to accept the heat exchanger positioned within an opening in the mounting bracket, wherein the mounting bracket is further configured to engage flanges of at least four respective sides of the heat exchanger when the heat exchanger is positioned in the opening of the mounting bracket;

fastener passages in the mounting bracket configured to accept fasteners that couple the mounting bracket to mounting hardware for the processor, wherein the fasteners, when coupled to the mounting hardware for the processor, cause the mounting bracket to exert a compressive force on the flanges of the heat exchanger; and

an anti-tilt hole in the mounting bracket configured to accept insertion of an anti-tilt pin mounted at a first end on a given one of the flanges of the heat exchanger and extending up from the given flange, wherein the anti-tilt pin, when inserted in the anti-tilt hole, restricts rotation of the mounting bracket relative to the heat exchanger;

wherein the fastener passages in the mounting bracket are positioned and sized to complement a corresponding fastener layout of the mounting hardware for the processor.