CPC H05K 7/20263 (2013.01) [H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20772 (2013.01)] | 18 Claims |
1. A liquid cooling module for cooling an electronic component, the liquid cooling module comprising:
a fluid tank configured to hold cooling fluid therein;
a first movable radiator and a second movable radiator coupled to the fluid tank, the first movable radiator and the second movable radiator each being configured to move between a first position relative to the fluid tank and a second position relative to the fluid tank;
a first cooling tube fluidly coupled to the fluid tank and the first movable radiator to allow the cooling fluid to flow between the fluid tank and the first movable radiator, and
a second cooling tube fluidly coupled to the fluid tank and the first movable radiator to allow the cooling fluid to flow between the fluid tank and the first movable radiator; and,
wherein when the first movable radiator is in its first position relative to the fluid tank, the first movable radiator extends from the fluid tank in a first direction,
wherein when the first movable radiator is in its second position relative to the fluid tank, the first movable radiator extends from the fluid tank in a second direction, the second direction being different than the first direction, and
wherein when the second movable radiator is in its first position relative to the fluid tank, the second movable radiator extends in a third direction that is parallel to and opposite of the first direction.
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