US 11,910,538 B2
Electronic device housings with patterned electrolytic plating layers
Yi-Chen Chen, Taipei (TW); Kun Cheng Tsai, Taipei (TW); Kuan-Ting Wu, Taipei (TW); Ying-Hung Ku, Taipei (TW); and Hsueh Chen Hung, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/602,884
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Aug. 8, 2019, PCT No. PCT/US2019/045593
§ 371(c)(1), (2) Date Oct. 11, 2021,
PCT Pub. No. WO2021/025695, PCT Pub. Date Feb. 11, 2021.
Prior Publication US 2022/0167505 A1, May 26, 2022
Int. Cl. H05K 3/18 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); H05K 5/00 (2006.01)
CPC H05K 3/181 (2013.01) [H05K 1/09 (2013.01); H05K 1/117 (2013.01); H05K 3/027 (2013.01); H05K 3/188 (2013.01); H05K 3/403 (2013.01); H05K 5/0026 (2013.01); H05K 2203/0502 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first circuit board;
a second circuit board;
a housing to house the first circuit board and the second circuit board;
an insulating adhesive layer formed on a surface of the housing;
a patterned electroconductive layer formed on the insulating adhesive layer to electrically connect the first circuit board and the second circuit board, wherein the patterned electroconductive layer comprises:
a patterned electroless plating layer formed on the insulating adhesive layer; and
a patterned electrolytic plating layer formed on the patterned electroless plating layer;
a first contact pad formed on the insulating adhesive layer and connected to a first end of the patterned electroconductive layer;
a second contact pad formed on the insulating adhesive layer and connected to a second end of the patterned electroconductive layer, wherein the first contact pad is electrically connected to the second contact pad using the patterned electroconductive layer;
a first surface contact connector having a first end connected to the first circuit board via a first spring and a second end physically engaged with the first contact pad; and
a second surface contact connector having a first end connected to the second circuit board via a second spring and a second end physically engaged with the second contact pad.