US 11,910,537 B2
Pattern transfer printing systems and methods
Gad Igra, Ness Ziona (IL); Eyal Cohen, Kfar-Saba (IL); Eran Yunger, Moshav Sdei Avraham (IL); Moshe Finarov, Rechovot (IL); Tao Xu, Wuhan (CN); Jing Shi, Wuhan (CN); Weiguo Tong, Wuhan (CN); and Zhigang Li, Wuhan (CN)
Assigned to Wuhan DR Laser Technology Corp,. LTD, Wuhan (CN)
Filed by Wuhan Dr Laser Technology Corp., Ltd., Wuhan (CN)
Filed on Jan. 25, 2022, as Appl. No. 17/583,440.
Claims priority of application No. 202111321391.3 (CN), filed on Nov. 9, 2021; application No. 202122732445.7 (CN), filed on Nov. 9, 2021; and application No. 290194 (IL), filed on Jan. 19, 2022.
Prior Publication US 2023/0148357 A1, May 11, 2023
Int. Cl. B41J 2/44 (2006.01); B41J 2/47 (2006.01); B41J 2/475 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01)
CPC H05K 3/1258 (2013.01) [B41J 2/442 (2013.01); B41J 2/47 (2013.01); B41J 2/475 (2013.01); H05K 1/092 (2013.01); H05K 1/11 (2013.01); H05K 3/107 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A pattern transfer printing (PTP) system comprising:
a tape handling unit configured to handle a tape comprising, as sections thereof, a plurality of pattern transfer sheets having respective patterns of trenches, and to controllably deliver the pattern transfer sheets for paste filling and consecutively for pattern transfer,
a paste filling unit configured to fill the trenches on the delivered pattern transfer sheets with conductive printing paste,
a wafer handling unit configured to controllably deliver at least one wafer for the pattern transfer at a close proximity to the pattern transfer sheet,
a paste transfer unit configured to transfer the conductive printing paste from the pattern transfer sheets filled with the conductive printing paste onto the wafer delivered in position, by releasing the conductive printing paste from the trenches upon illumination by a laser beam,
wherein the tape handling unit is configured to move the tape from an unwinder roll to a re-winding roll in a step-and-repeat mode,
wherein the PTP system further comprises at least one of:
a trench alignment monitoring unit configured to monitor a position and a distortion of the trenches prior to the pattern transfer, wherein the trench alignment monitoring unit comprises multiple imaging cameras configured to capture ends of the trenches and at least two tilted imaging cameras configured to capture at least middle-sections of the trenches, wherein the tilt is with respect to a vertical direction and is configured to capture the middle-sections of the trenches; and/or
a wafer alignment unit configured to detect and measure features on the wafer and further adjust the wafer position in the pattern transfer unit accordingly, wherein the wafer alignment unit comprises multiple imaging cameras configured to capture at least a part of a perimeter of the wafer, the cameras configured to image the wafer corners and features at a middle of the wafer.