US 11,910,156 B1
Audio modules with fins to reduce acoustic noise due to airflow
Marco Baratelli, San Francisco, CA (US); Claudio Notarangelo, San Francisco, CA (US); Matthew A. Donarski, San Francisco, CA (US); and Mo C. Chan, Cupertino, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Aug. 25, 2022, as Appl. No. 17/895,984.
Int. Cl. H04R 1/28 (2006.01)
CPC H04R 1/2888 (2013.01) 20 Claims
OG exemplary drawing
 
1. An audio module, comprising:
an enclosure that includes:
a first volume that stores at least one audio component, and
a second volume defining a channel that forms an acoustic path for the at least one audio component; and
a plurality of fins at least partially disposed in the channel, the plurality of fins comprising:
a first fin having a first length, and
a second fin having a second length greater than the first length.