CPC H01P 3/121 (2013.01) [H01P 1/2088 (2013.01); H01P 3/123 (2013.01); H05K 1/0237 (2013.01); H05K 1/115 (2013.01); H05K 2201/09618 (2013.01)] | 10 Claims |
1. A printed circuit board comprising a horizontally extending dielectric substrate and a substrate integrated waveguide (SIW) having at least one ridge;
said SIW comprising first and second horizontally disposed conductive ground planes spaced by a vertical distance, and two vertically disposed conductive fences spanning therebetween, said fences extending in a first horizontal direction, and being spaced from one another in a second horizontal direction, perpendicular to the first horizontal direction;
at least one of said fences comprising a plurality of horizontally disposed conductive strips vertically spaced from one another and extending in the first horizontal direction, at least some of said conductive strips being wall-strips, and at least some of said conductive strips being ridge-strips constituting at least a portion of said at least one ridge and extending from their respective fences in the second horizontal direction toward the other of said fences to an extent greater than said wall-strips.
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