CPC H01L 31/16 (2013.01) [H01L 24/73 (2013.01); H01L 2224/73265 (2013.01)] | 15 Claims |
1. A method of manufacturing an optoelectronic device, comprising:
encapsulating an emitter of light rays in a first transparent block;
forming a layer at least partially covering an upper surface and a side surface of the first transparent block, said layer being opaque to wavelengths of light rays emitted by the emitter;
mounting a receiver of light rays to said layer at the upper surface of the first transparent block.
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