US 11,908,861 B2
Semiconductor device and method of fabricating the same
Munhyeon Kim, Hwaseong-si (KR); Mingyu Kim, Hwaseong-si (KR); Doyoung Choi, Hwaseong-si (KR); and Daewon Ha, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Suwoni-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 5, 2021, as Appl. No. 17/394,580.
Claims priority of application No. 10-2020-0168315 (KR), filed on Dec. 4, 2020.
Prior Publication US 2022/0181323 A1, Jun. 9, 2022
Int. Cl. H01L 27/092 (2006.01)
CPC H01L 27/0922 (2013.01) 19 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
an active pattern on a substrate;
a pair of source/drain patterns on the active pattern;
fence spacers on opposing side surfaces of each of the pair of source/drain patterns;
a channel pattern extending between the pair of source/drain patterns;
a gate electrode crossing the channel pattern and extending in a first direction; and
a gate spacer on a side surface of the gate electrode,
wherein a first thickness of an upper portion of the fence spacers in the first direction is greater than a second thickness of the gate spacer in a second direction crossing the first direction,
wherein the source/drain patterns have a first height, the fence spacers have a second height, and the second height is 50% to 100% of the first height.