US 11,908,832 B2
Process for collectively bending microelectronic components using shaping carrier
Alexis Rochas, Grenoble (FR); David Henry, Grenoble (FR); and Stéphane Caplet, Grenoble (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed by COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed on Dec. 21, 2021, as Appl. No. 17/645,360.
Claims priority of application No. 20 13960 (FR), filed on Dec. 22, 2020.
Prior Publication US 2022/0199572 A1, Jun. 23, 2022
Int. Cl. H01L 21/52 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/97 (2013.01) [H01L 21/52 (2013.01); H01L 24/08 (2013.01); H01L 2224/08235 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A process for collectively bending microelectronic components comprising the following steps:
producing a microelectronic structure, comprising a microelectronic substrate, having an upper face and an opposite lower face, comprising a plurality of microelectronic components, each of the plurality of microelectronic components comprises lower conductive pads located on the opposite lower face and intended to allow the plurality of microelectronic components to be connected electrically;
providing a shaping carrier having an upper face and an opposite lower face, wherein the upper face comprising a plurality of curved surfaces;
depositing an adhesive lower layer having a thickness larger than the thickness of the lower conductive pads, so as: either to entirely cover the opposite lower face of the microelectronic substrate and the lower conductive pads such that the adhesive lower layer has a free lower face that is continuous and therefore not passed right through by the lower conductive pads which would otherwise protrude from the adhesive lower layer; or to cover the plurality of curved surfaces;
dicing at least the microelectronic substrate to singulate the plurality of microelectronic components; then
transferring the plurality of microelectronic components to the shaping carrier; then
bending the plurality of microelectronic components, the adhesive lower layer then making contact with the lower face of the plurality of microelectronic components and with a corresponding curved surface, thus preventing the lower conductive pads from making contact with the plurality of curved surfaces; then
producing conductive vias that extend through the shaping carrier and the adhesive lower layer from the opposite lower face of the shaping carrier, in order to emerge onto the lower conductive pads.