US 11,908,823 B2
Devices incorporating stacked bonds and methods of forming the same
Erwin Orejola, Gilroy, CA (US); Brian Condie, Gilroy, CA (US); and Ulf Andre, Hillsborough, NC (US)
Assigned to Wolfspeed, Inc., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on Jan. 11, 2021, as Appl. No. 17/145,794.
Prior Publication US 2022/0223559 A1, Jul. 14, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/66 (2006.01)
CPC H01L 24/46 (2013.01) [H01L 24/05 (2013.01); H01L 2924/1423 (2013.01)] 37 Claims
OG exemplary drawing
 
1. A packaged semiconductor device comprising:
a first bond wire comprising a first end and a second end; and
a second bond wire comprising a first end and a second end, wherein the first end of the second bond wire is bonded to a surface of the first end of the first bond wire,
wherein the first end of the second bond wire and the first end of the first bond wire comprise respective widths in a horizontal direction or respective thicknesses in a vertical direction that differ from one another, and
wherein an operating frequency of the packaged semiconductor device is between 500 MHz and 75 GHz.