US 11,908,780 B2
Semiconductor package with solder standoff
Jonathan Almeria Noquil, Plano, TX (US); Satyendra Singh Chauhan, Murphy, TX (US); Lance Cole Wright, Allen, TX (US); and Osvaldo Jorge Lopez, Annadale, NJ (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Nov. 3, 2021, as Appl. No. 17/518,554.
Application 17/518,554 is a continuation of application No. 16/581,971, filed on Sep. 25, 2019, granted, now 11,177,197.
Prior Publication US 2022/0115308 A1, Apr. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49575 (2013.01) [H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/92 (2013.01); H01L 25/074 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 24/97 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40145 (2013.01); H01L 2224/40177 (2013.01); H01L 2224/4118 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/2064 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a leadframe including a die pad and a plurality of lead terminals;
a semiconductor device attached on a first side by a die attach material to the die pad,
a first clip on the semiconductor device that is connected to a terminal of the semiconductor device on a second side opposite to the first side providing a first bonded interface, wherein the first clip is connected to at least a first of the plurality of lead terminals;
wherein the first bonded interface includes a first non-metallic protruding surface standoff therein that extends from a surface on the second side of the semiconductor device to physically contact the first clip.