CPC H01L 23/3171 (2013.01) [H01L 21/02282 (2013.01); H01L 23/3178 (2013.01)] | 20 Claims |
1. A method for producing a structure, the method comprising:
providing a semiconductor-based substrate having a functional structure that is arranged in the semiconductor-based substrate;
arranging a frame structure in the semiconductor-based substrate such that the frame structure laterally surrounds the functional structure in the semiconductor-based substrate; and
arranging over the semiconductor-based substrate an ink coating having planar upper and lower surfaces such that the ink coating covers the functional structure and is delimited by the frame structure.
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