CPC H01L 23/049 (2013.01) [H01L 21/52 (2013.01); H01L 23/06 (2013.01); H01L 23/13 (2013.01); H01L 23/16 (2013.01); H01L 23/49888 (2013.01); H01L 23/552 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a qubit chip positioned on an interposer chip;
an electrical connector in direct contact with the interposer chip, wherein the electrical connector establishes an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip;
an enclosure lid positioned adjacent to the qubit chip and the interposer chip, wherein the electrical connector extends through the enclosure lid; and
an isolation barrier extending from the enclosure lid to the interposer chip, wherein the isolation barrier at least partially surrounds the qubit chip.
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