US 11,908,756 B2
Interposer chips and enclosures for quantum circuits
David Abraham, Croton, NY (US); and John Michael Cotte, New Fairfield, CT (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Dec. 16, 2021, as Appl. No. 17/644,695.
Prior Publication US 2023/0197539 A1, Jun. 22, 2023
Int. Cl. H01L 23/049 (2006.01); H01L 23/498 (2006.01); H01L 23/16 (2006.01); H01L 23/13 (2006.01); H01L 23/06 (2006.01); H01L 23/552 (2006.01); H01L 21/52 (2006.01)
CPC H01L 23/049 (2013.01) [H01L 21/52 (2013.01); H01L 23/06 (2013.01); H01L 23/13 (2013.01); H01L 23/16 (2013.01); H01L 23/49888 (2013.01); H01L 23/552 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a qubit chip positioned on an interposer chip;
an electrical connector in direct contact with the interposer chip, wherein the electrical connector establishes an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip;
an enclosure lid positioned adjacent to the qubit chip and the interposer chip, wherein the electrical connector extends through the enclosure lid; and
an isolation barrier extending from the enclosure lid to the interposer chip, wherein the isolation barrier at least partially surrounds the qubit chip.