US 11,908,753 B2
Test head connection method
Kao-Shan Yang, Taoyuan (TW); and Ching-Li Lin, Taoyuan (TW)
Assigned to Chroma ATE Inc., Taoyuan (TW)
Filed by Kao-Shan Yang, Taoyuan (TW); and Ching-Li Lin, Taoyuan (TW)
Filed on Nov. 6, 2021, as Appl. No. 17/520,631.
Claims priority of application No. 109140284 (TW), filed on Nov. 18, 2020.
Prior Publication US 2022/0068726 A1, Mar. 3, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 21/683 (2006.01); G01R 1/00 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/00 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01)
CPC H01L 22/12 (2013.01) [G01R 1/07342 (2013.01); H01L 21/6838 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A test head connection method for connecting a test head and a probing machine, comprising:
disposing a load board and a test fixture between the test head and the probing machine;
activating a vacuum function of the test head;
moving the test head to align the test fixture;
moving the test head until touching the load board in the test fixture; and
fixing the test head and the test fixture by at least one engaging member;
wherein the test fixture is disposed in the probing machine, and the test fixture is used to accommodate the load board;
wherein the load board is configured to connect a wafer by direct docking without a pogo tower.