CPC H01L 22/12 (2013.01) [G01R 1/07342 (2013.01); H01L 21/6838 (2013.01)] | 10 Claims |
1. A test head connection method for connecting a test head and a probing machine, comprising:
disposing a load board and a test fixture between the test head and the probing machine;
activating a vacuum function of the test head;
moving the test head to align the test fixture;
moving the test head until touching the load board in the test fixture; and
fixing the test head and the test fixture by at least one engaging member;
wherein the test fixture is disposed in the probing machine, and the test fixture is used to accommodate the load board;
wherein the load board is configured to connect a wafer by direct docking without a pogo tower.
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