US 11,908,723 B2
Silicon handler with laser-release layers
Akihiro Horibe, Yokohama (JP); Qianwen Chen, Chappaqua, NY (US); Risa Miyazawa, Isehara (JP); Michael P. Belyansky, Halfmoon, NY (US); John Knickerbocker, Monroe, NY (US); and Takashi Hisada, Hachiouji (JP)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Dec. 3, 2021, as Appl. No. 17/541,946.
Prior Publication US 2023/0178404 A1, Jun. 8, 2023
Int. Cl. H01L 21/68 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/681 (2013.01) [H01L 21/6835 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68381 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A method for handling a wafer, comprising:
positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, an optical boundary layer, and an anti-reflection layer; and
debonding the handler from the wafer using a laser that emits laser energy at a wavelength that is absorbed by the debonding layer, that is confined to the debonding layer by the optical enhancement layer, and that is reflected back to the debonding layer by the optical boundary layer, such that the material of the debonding layer ablates when exposed to the laser energy to release the wafer.