US 11,908,719 B2
Rounded vertical wafer vessel rods
Ching-Wen Cheng, Zhubei (TW); Xin-Kai Huang, Hsinchu (TW); and Kuei-Hsiung Cho, Xinpu Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Aug. 8, 2022, as Appl. No. 17/883,597.
Application 17/883,597 is a continuation of application No. 16/746,049, filed on Jan. 17, 2020, granted, now 11,450,542.
Prior Publication US 2022/0384224 A1, Dec. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/673 (2006.01); C23C 16/458 (2006.01); H01L 21/02 (2006.01); C23C 16/46 (2006.01)
CPC H01L 21/67309 (2013.01) [C23C 16/4583 (2013.01); C23C 16/46 (2013.01); H01L 21/0217 (2013.01); H01L 21/02271 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a top base having an opening therein, wherein the top base includes a slot to form a C-shape such that the top base is not completely annular;
a bottom base; and
a rod set comprising multiple rods connected to the bottom base, wherein each rod of the rod set comprises multiple fingers disposed in a vertically-stacked relationship to each other and separated respectively from each other by respective slots.