US 11,908,715 B2
Dynamic temperature control of substrate support in substrate processing system
Sairam Sundaram, E Niskayuna, NY (US); Aaron Durbin, Portland, OR (US); and Ramesh Chandrasekharan, Portland, OR (US)
Assigned to LAM RESEARCH CORPORATION, Fremont, CA (US)
Appl. No. 17/256,677
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed Jul. 2, 2019, PCT No. PCT/US2019/040416
§ 371(c)(1), (2) Date Dec. 29, 2020,
PCT Pub. No. WO2020/010153, PCT Pub. Date Jan. 9, 2020.
Claims priority of provisional application 62/694,171, filed on Jul. 5, 2018.
Prior Publication US 2021/0272828 A1, Sep. 2, 2021
Int. Cl. H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67248 (2013.01) [H01L 21/68714 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A temperature-controlled substrate support for a substrate processing system comprising:
a substrate support including N zones and N resistive heaters, respectively, where N is an integer greater than one, and a temperature sensor located in one of the N zones; and
a controller configured to:
calculate N resistances of the N resistive heaters during operation; and
adjust power to N−1 of the N resistive heaters during operation of the substrate processing system in response to:
the temperature measured in the one of the N zones by the temperature sensor;
the N resistances of the N resistive heaters; and
N−1 resistance ratios.