US 11,908,709 B2
Container and method of preparing the same
Marcia Cole-Yocom, Scottsdale, AZ (US); and Bryan Hinzie, Gilbert, AZ (US)
Assigned to FUJIFILM Electronic Materials U.S.A., Inc., North Kingstown, RI (US)
Filed by FUJIFILM Electronic Materials U.S.A., Inc., North Kingstown, RI (US)
Filed on Jan. 22, 2020, as Appl. No. 16/748,826.
Claims priority of provisional application 62/799,035, filed on Jan. 30, 2019.
Prior Publication US 2020/0266080 A1, Aug. 20, 2020
Int. Cl. B65D 23/02 (2006.01); H01L 21/67 (2006.01); B65D 1/40 (2006.01); B65D 1/42 (2006.01); B65D 1/02 (2006.01); B08B 3/08 (2006.01); B08B 9/08 (2006.01)
CPC H01L 21/67023 (2013.01) [B08B 3/08 (2013.01); B08B 9/08 (2013.01); B65D 1/0215 (2013.01); B65D 1/40 (2013.01); B65D 1/42 (2013.01); B65D 23/02 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A container for containing a raw material of a chemical liquid used for semiconductor manufacturing, the container comprising:
an inner wall, constructed with a stainless steel material or coated with a resin material; and
a solvent-treated surface of the inner wall, wherein the solvent-treated surface comes in contact with the raw material that includes a solvent having a content of iron (Fe) or calcium (Ca) atoms of 1 ppb or less and a content of organic impurities of 10 mass ppm or less during a course of being contained in the container,
wherein the solvent-treated surface comprises a water-treated surface, which is configured by treating a surface of the inner wall with only deionized water, or
wherein the solvent-treated surface comprises an organic solvent-treated surface, which is configured by treating a surface of the inner wall with only an organic solvent as the solvent included in the raw material, or
wherein the solvent-treated surface comprises a water-organic solvent-treated surface, which is configured by treating a surface of the inner wall with only deionized water, followed by treating the surface of the inner wall with only an organic solvent as the solvent included in the raw material.