US 11,908,708 B2
Laser de-bonding carriers and composite carriers thereof
Huicheng Chang, Tainan (TW); Jyh-Cherng Sheu, Hsinchu (TW); Chen-Fong Tsai, Hsinchu (TW); Yun Chen Teng, New Taipei (TW); Han-De Chen, Hsinchu (TW); and Yee-Chia Yeo, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Sep. 20, 2021, as Appl. No. 17/479,467.
Claims priority of provisional application 63/211,723, filed on Jun. 17, 2021.
Prior Publication US 2022/0406621 A1, Dec. 22, 2022
Int. Cl. H01L 21/56 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 21/568 (2013.01) [H01L 21/561 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
bonding a package component to a composite carrier, wherein the composite carrier comprises:
a base carrier; and
an absorption layer, wherein the absorption layer is between the base carrier and the package component, and wherein the absorption layer comprises a titanium nitride layer;
projecting a laser beam onto the composite carrier, wherein the laser beam penetrates through the base carrier to ablate the absorption layer; and
separating the base carrier from the package component.