CPC H01L 21/568 (2013.01) [H01L 21/561 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01)] | 20 Claims |
1. A method comprising:
bonding a package component to a composite carrier, wherein the composite carrier comprises:
a base carrier; and
an absorption layer, wherein the absorption layer is between the base carrier and the package component, and wherein the absorption layer comprises a titanium nitride layer;
projecting a laser beam onto the composite carrier, wherein the laser beam penetrates through the base carrier to ablate the absorption layer; and
separating the base carrier from the package component.
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