US 11,908,699 B2
Semiconductor packages with die including cavities
Michael J. Seddon, Gilbert, AZ (US); Francis J. Carney, Phoenix, AZ (US); Chee Hiong Chew, Seremban (MY); Soon Wei Wang, Seremban (MY); and Eiji Kurose, Oizumi-machi (JP)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Apr. 25, 2022, as Appl. No. 17/660,477.
Application 16/545,139 is a division of application No. 16/101,259, filed on Aug. 10, 2018, granted, now 10,446,480, issued on Oct. 15, 2019.
Application 16/702,958 is a division of application No. 15/679,661, filed on Aug. 17, 2017, granted, now 10,529,576, issued on Jan. 7, 2020.
Application 16/101,259 is a division of application No. 15/244,737, filed on Aug. 23, 2016, granted, now 10,079,199, issued on Sep. 18, 2018.
Application 17/660,477 is a continuation of application No. 16/985,995, filed on Aug. 5, 2020, granted, now 11,342,189.
Application 16/985,995 is a continuation in part of application No. 16/862,120, filed on Apr. 29, 2020, granted, now 11,430,746.
Application 16/862,120 is a continuation in part of application No. 16/861,740, filed on Apr. 29, 2020.
Application 16/861,740 is a continuation in part of application No. 16/862,063, filed on Apr. 29, 2020.
Application 16/861,740 is a continuation in part of application No. 16/702,958, filed on Dec. 4, 2019, granted, now 11,328,930.
Application 16/985,995 is a continuation of application No. 16/545,139, filed on Aug. 20, 2019, granted, now 10,950,534, issued on Mar. 16, 2021.
Application 16/861,740 is a continuation in part of application No. 16/395,822, filed on Apr. 26, 2019, granted, now 10,763,173.
Application 16/395,822 is a continuation of application No. 15/679,664, filed on Aug. 17, 2017, granted, now 10,319,639, issued on Jun. 11, 2019.
Claims priority of provisional application 62/219,666, filed on Sep. 17, 2015.
Prior Publication US 2022/0246434 A1, Aug. 4, 2022
Int. Cl. H01L 21/302 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/12 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/302 (2013.01) [H01L 21/48 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/12 (2013.01); H01L 23/3185 (2013.01); H01L 24/04 (2013.01); H01L 24/26 (2013.01); H01L 2224/94 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a semiconductor die comprising a first side and a second side opposite the first side;
a cavity extending into the second side of the semiconductor die and only partially through the semiconductor die;
a backmetal coupled within the cavity and directly coupled to an entirety of the second side; and
an organic material coupled over the first side of the semiconductor die and over a plurality of sidewalls of the semiconductor die;
wherein a first portion of the first side directly opposite the cavity is coplanar with a second portion of the first side at an outer edge of the first side.