US 11,907,759 B2
Technologies for providing predictive thermal management
Chungwen Ma, Taipei (TW); and Shuling Chiu, Taipei (TW)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 18, 2021, as Appl. No. 17/352,141.
Application 17/352,141 is a continuation of application No. 15/997,757, filed on Jun. 5, 2018, granted, now 11,042,406.
Prior Publication US 2022/0043679 A1, Feb. 10, 2022
Int. Cl. G06F 9/48 (2006.01); G06F 11/30 (2006.01); G06F 11/34 (2006.01); G06F 9/50 (2006.01); G06F 1/32 (2019.01); G06F 1/26 (2006.01); G05D 23/19 (2006.01)
CPC G06F 9/4893 (2013.01) [G05D 23/1917 (2013.01); G06F 1/26 (2013.01); G06F 1/32 (2013.01); G06F 9/50 (2013.01); G06F 9/505 (2013.01); G06F 9/5027 (2013.01); G06F 9/5044 (2013.01); G06F 9/5083 (2013.01); G06F 9/5094 (2013.01); G06F 11/3024 (2013.01); G06F 11/3409 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus comprising:
memory;
instructions; and
programmable circuitry to execute the instructions to:
detect utilization of devices, wherein the devices are to perform at least one workload; and
adjust the utilization of the devices based at least on temperatures of the devices, wherein the devices include at least two different types of devices, the different types of devices including: (i) a graphics processing unit (GPU), (ii) a central processing unit (CPU), (iii) an accelerator, (iv) an application specific integrated circuit (ASIC), (v) communication circuitry or (vi) a data storage device.