US 11,906,846 B2
Display device and manufacturing method therefor
Youngchol Lee, Suwon-si (KR); Hyungsuk Kim, Suwon-si (KR); Naewon Jang, Suwon-si (KR); Seokwoo Yong, Suwon-si (KR); and Junsung Choi, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 23, 2023, as Appl. No. 18/113,359.
Application 18/113,359 is a continuation of application No. PCT/KR2021/010206, filed on Aug. 4, 2021.
Claims priority of application No. 10-2020-0119189 (KR), filed on Sep. 16, 2020.
Prior Publication US 2023/0194927 A1, Jun. 22, 2023
Int. Cl. G02F 1/1335 (2006.01); G02F 1/13357 (2006.01)
CPC G02F 1/133614 (2021.01) [G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133608 (2013.01); G02F 1/133612 (2021.01); G02F 1/133621 (2013.01); G02F 2201/346 (2013.01); G02F 2202/36 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A display device comprising:
a liquid crystal panel; and
a light source plate disposed behind the liquid crystal panel configured to provide the liquid crystal panel with light,
wherein the light source plate includes:
a printed circuit board (PCB) having a mounting surface;
a light emitting diode (LED) chip mounted on the mounting surface;
a transparent resin disposed on the LED chip to substantially surround the LED chip;
a light conversion layer configured to convert a wavelength of light emitted from the LED chip, the light conversion layer substantially surrounding an outer surface of the transparent resin;
a barrier layer covering the light conversion layer from an outside; and
an auxiliary light conversion layer disposed on the mounting surface adjacent to the LED chip, wherein a portion of the auxiliary light conversion layer above the mounting surface is substantially surrounded by the transparent resin and the auxiliary light conversion layer is configured to convert a wavelength of light emitted from the LED chip.