US 11,906,799 B2
Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
Joel Richard Goergen, Soulsbyville, CA (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Mar. 7, 2022, as Appl. No. 17/688,271.
Application 17/688,271 is a continuation of application No. 16/983,932, filed on Aug. 3, 2020, granted, now 11,307,368.
Application 16/983,932 is a continuation in part of application No. 16/842,393, filed on Apr. 7, 2020, granted, now 11,320,610.
Claims priority of provisional application 63/012,822, filed on Apr. 20, 2020.
Prior Publication US 2022/0187553 A1, Jun. 16, 2022
Int. Cl. G02B 6/42 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01)
CPC G02B 6/4268 (2013.01) [G02B 6/4214 (2013.01); H01L 23/3675 (2013.01); H01L 23/49827 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an upper cold plate and a lower cold plate, each of the upper cold plate and the lower cold plate comprising at least one of an electrical path or an optical path extending therethrough;
a substrate and die package interposed between the upper cold plate and the lower cold plate; and
a power block,
wherein an optical signal is delivered to or from the substrate and die package via the optical path extending through a first cold plate of the upper cold plate and the lower cold plate, and power is supplied to the substrate and die package via the electrical path extending through a second cold plate of the upper cold plate and the lower cold plate, and
wherein the power block is configured to be inserted into the second cold plate and includes the electrical path that extends beyond an inner surface of the second cold plate to contact the substrate and die package.