US 11,906,781 B2
End-face coupling structures underneath a photonic layer
Roman Bruck, Vienna (AT); and Gianlorenzo Masini, Carlsbad, CA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Dec. 12, 2022, as Appl. No. 18/064,506.
Application 18/064,506 is a division of application No. 17/248,579, filed on Jan. 29, 2021, granted, now 11,567,262.
Prior Publication US 2023/0112848 A1, Apr. 13, 2023
Int. Cl. G02B 6/136 (2006.01); G02B 6/125 (2006.01)
CPC G02B 6/136 (2013.01) [G02B 6/125 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a photonic wafer comprising an electrical layer and a layer disposed on a substrate, wherein the layer comprises at least one optical waveguide that is disposed between the electrical layer and the substrate; and
an end-face coupler, wherein a portion of the end-face coupler is within a portion of the substrate underneath the at least one optical waveguide, and wherein the end-face coupler is configured to direct an optical signal to or from the optical waveguide and comprises an optical interface for end-face coupling.