CPC G01B 7/06 (2013.01) [C25D 5/007 (2020.08); C25D 17/005 (2013.01); C25D 17/02 (2013.01); C25D 17/10 (2013.01); C25D 21/14 (2013.01); G01R 15/12 (2013.01); G01R 15/181 (2013.01)] | 4 Claims |
1. A plating apparatus comprising:
a plating tank configured to store a plating solution and internally including an anode;
a substrate holder disposed above the anode and configured to hold a substrate as a cathode;
a rotation mechanism configured such that the rotation mechanism rotates the substrate holder when a plating process is performed on the substrate;
a plurality of contact members disposed in the substrate holder and arranged in a circumferential direction of the substrate holder, the plurality of contact members being configured to contact an outer peripheral edge of a lower surface of the substrate to supply electricity to the substrate in the plating process;
a coil configured to generate a current by an electromagnetic induction due to a magnetic field caused by a current flowing into a contact member of the plurality of contact members, the plurality of contact members being configured to rotate together with the substrate holder in the plating process;
a current sensor configured to detect the current generated in the coil; and
a film thickness measuring device configured to measure a film thickness of the substrate based on the current detected by the current sensor in the plating process.
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