US 11,906,299 B2
Plating apparatus and film thickness measuring method for substrate
Masaya Seki, Tokyo (JP); Masaki Tomita, Tokyo (JP); and Shao Hua Chang, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/616,906
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Jan. 20, 2021, PCT No. PCT/JP2021/001833
§ 371(c)(1), (2) Date Dec. 6, 2021,
PCT Pub. No. WO2022/157852, PCT Pub. Date Jul. 28, 2022.
Prior Publication US 2023/0152077 A1, May 18, 2023
Int. Cl. G01B 7/06 (2006.01); C25D 17/00 (2006.01); C25D 17/02 (2006.01); C25D 17/10 (2006.01); C25D 21/14 (2006.01); G01R 15/12 (2006.01); G01R 15/18 (2006.01); C25D 5/00 (2006.01)
CPC G01B 7/06 (2013.01) [C25D 5/007 (2020.08); C25D 17/005 (2013.01); C25D 17/02 (2013.01); C25D 17/10 (2013.01); C25D 21/14 (2013.01); G01R 15/12 (2013.01); G01R 15/181 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank configured to store a plating solution and internally including an anode;
a substrate holder disposed above the anode and configured to hold a substrate as a cathode;
a rotation mechanism configured such that the rotation mechanism rotates the substrate holder when a plating process is performed on the substrate;
a plurality of contact members disposed in the substrate holder and arranged in a circumferential direction of the substrate holder, the plurality of contact members being configured to contact an outer peripheral edge of a lower surface of the substrate to supply electricity to the substrate in the plating process;
a coil configured to generate a current by an electromagnetic induction due to a magnetic field caused by a current flowing into a contact member of the plurality of contact members, the plurality of contact members being configured to rotate together with the substrate holder in the plating process;
a current sensor configured to detect the current generated in the coil; and
a film thickness measuring device configured to measure a film thickness of the substrate based on the current detected by the current sensor in the plating process.