US 11,905,372 B2
Highly heat-resistant and low dielectric-polymide film and method for producing same
Sung-Yul Back, Chungcheongbuk (KR); Min-Sang Cho, Chungcheongbuk (KR); Jin-Seok Jeon, Chungcheongbuk (KR); Ki-Hoon Kim, Chungcheongbuk (KR); and Kil-Nam Lee, Chungcheongbuk (KR)
Assigned to PI Advanced Materials Co., Ltd., Chungcheongbuk-do (KR)
Appl. No. 17/775,185
Filed by PI Advanced Materials Co., Ltd., Chungcheongbuk (KR)
PCT Filed Dec. 2, 2019, PCT No. PCT/KR2019/016848
§ 371(c)(1), (2) Date May 6, 2022,
PCT Pub. No. WO2021/091011, PCT Pub. Date May 14, 2021.
Claims priority of application No. 10-2019-0141458 (KR), filed on Nov. 7, 2019.
Prior Publication US 2022/0396667 A1, Dec. 15, 2022
Int. Cl. C08G 73/10 (2006.01); B32B 27/28 (2006.01); B32B 27/08 (2006.01); C08J 5/18 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01)
CPC C08G 73/1042 (2013.01) [B32B 27/08 (2013.01); B32B 27/281 (2013.01); C08G 73/1032 (2013.01); C08G 73/1067 (2013.01); C08J 5/18 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 2250/24 (2013.01); B32B 2307/30 (2013.01); B32B 2307/7246 (2013.01); C08J 2379/08 (2013.01)] 4 Claims
 
1. A polyimide film, including a block copolymer comprising:
a first block obtained by imidizing a dianhydride component consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride with diamine component consisting p-phenylenediamine, and
a second block obtained by imidizing a dianhydride component consisting of pyromellitic dianhydride with a diamine component consisting of m-tolidine,
wherein the 3,3′,4,4′-benzophenonetetracarboxylic dianhydride is used at a content of 15% by mole to 35% by mole and the 3,3′,4,4′-biphenyltetracarboxylic dianhydride is used at a content of 35% by mole to 75% by mole, based on a total of 100% by mole of the dianhydride component in the first block and the second block,
wherein the m-tolidine is used at a content of 20% by mole to 40% by mole and the p-phenylenediamine is used at a content of 60% by mole to 80% by mole, based on a total of 100% by mole of the diamine component in the first block and the second block,
wherein a glass transition temperature (Tg) of 320° C. or higher, a moisture absorption rate measured by the ASTM D570 test method is 0.4 wt % or less, and a dielectric dissipation factor (Df) of 0.004 or less at a frequency of 10 GHz.