US 11,905,164 B2
Micro-electro-mechanical system acoustic sensor, micro-electro-mechanical system package structure and method for manufacturing the same
Hsien-Lung Ho, New Taipei (TW); Da-Ming Chiang, New Taipei (TW); and Chung-Chieh Chen, New Taipei (TW)
Assigned to UPBEAT TECHNOLOGY CO., LTD, New Taipei (TW)
Filed by UPBEAT TECHNOLOGY Co., Ltd, New Taipei (TW)
Filed on Sep. 7, 2021, as Appl. No. 17/468,423.
Claims priority of provisional application 63/075,339, filed on Sep. 8, 2020.
Claims priority of application No. 110116773 (TW), filed on May 10, 2021.
Prior Publication US 2022/0073342 A1, Mar. 10, 2022
Int. Cl. B81B 3/00 (2006.01)
CPC B81B 3/0021 (2013.01) [B81B 2201/0264 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A micro-electro-mechanical system acoustic sensor, comprising:
a substrate;
a cantilever structure formed on the substrate, and comprising a fixed end and a free cantilever portion extended from the fixed end, wherein the free cantilever portion comprises a free end, the free end and the fixed end are at opposing sides of the free cantilever portion, the free cantilever portion is capable of generating a vibration wave in an empty space; and
a diaphragm sensor formed on the substrate, and comprising:
a diaphragm film;
a back plate, wherein the back plate and the diaphragm film have a first empty gap therebetween, wherein the empty space and the first empty gap are communicated to each other, the diaphragm film is adapted to receive the vibration wave generated by the free cantilever portion; and
at least one electrical contact point electrically connected to the back plate.