US 11,904,490 B2
Systems and methods for high throughput cutting of sealing elements on packages
Bryan Hawkins, Bentonville, AR (US); Joseph David Blackner, Bella Vista, AR (US); John Marshall Jones, Fayetteville, AR (US); Santos Cerda, Jr., Centerton, AR (US); and Geoffrey Michael Miller, Rogers, AR (US)
Assigned to Walmart Apollo, LLC, Bentonville, AR (US)
Filed by Walmart Apollo, LLC, Bentonville, AR (US)
Filed on Nov. 21, 2022, as Appl. No. 17/990,871.
Application 17/990,871 is a continuation of application No. 16/527,735, filed on Jul. 31, 2019, abandoned.
Claims priority of provisional application 62/717,179, filed on Aug. 10, 2018.
Prior Publication US 2023/0081340 A1, Mar. 16, 2023
Int. Cl. B26D 7/06 (2006.01); B65B 69/00 (2006.01); B65G 13/04 (2006.01)
CPC B26D 7/0625 (2013.01) [B65B 69/0033 (2013.01); B65G 13/04 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A cutting system comprising:
a cutting device, including:
an optical radiation source that focuses at a focal point;
a translation apparatus to adjust a location of the focal point in three-dimensional space; and
a cutting device conveyor to convey a package past the optical radiation source;
wherein the cutting device is controlled by a computing device;
wherein the computing device is configured to execute instructions to align the focal point of the optical radiation source to a sealing element of the package based on data related to a position or dimension of the package using the translation apparatus and apply radiation from the optical radiation source to the sealing element.