US 11,904,410 B2
Laser surface preparation of coated substrate
Alejandro Antonio Becker, Stockdorf (DE); Tobias Christian Roeder, Munich (DE); Helmut Schillinger, Munich (DE); and Ralf J Terbrueggen, Neuried (DE)
Assigned to Corning Incorporated, Corning, NY (US)
Filed by CORNING INCORPORATED, Corning, NY (US)
Filed on Oct. 5, 2016, as Appl. No. 15/285,773.
Claims priority of provisional application 62/238,356, filed on Oct. 7, 2015.
Prior Publication US 2017/0100801 A1, Apr. 13, 2017
Int. Cl. B23K 26/402 (2014.01); C03B 33/09 (2006.01); B23K 26/142 (2014.01); B23K 26/364 (2014.01); B26F 3/06 (2006.01); B23K 26/18 (2006.01); C03C 17/32 (2006.01); B23K 26/073 (2006.01); B23K 26/082 (2014.01); C03B 33/07 (2006.01); B23K 26/40 (2014.01); B23K 26/0622 (2014.01); B26F 3/00 (2006.01); B23K 103/00 (2006.01); B23K 103/16 (2006.01); B23K 101/34 (2006.01)
CPC B23K 26/402 (2013.01) [B23K 26/0624 (2015.10); B23K 26/0738 (2013.01); B23K 26/082 (2015.10); B23K 26/142 (2015.10); B23K 26/18 (2013.01); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B26F 3/002 (2013.01); B26F 3/06 (2013.01); C03B 33/074 (2013.01); C03B 33/091 (2013.01); C03C 17/32 (2013.01); B23K 2101/34 (2018.08); B23K 2103/172 (2018.08); B23K 2103/42 (2018.08); B23K 2103/54 (2018.08); C03C 2218/328 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method for laser preparation and laser cutting of a coated substrate, the method comprising:
substantially removing a target portion of a polymer coating from a substrate to form a coating removal pattern by directing an ablative laser beam to the target portion,
wherein the target portion of the polymer coating has a width between about 100 nm and about 4.0 mm,
wherein the ablative laser beam has a wavelength that is absorbed by the polymer coating, and
wherein the substrate comprises a material transparent to the wavelength of the ablative laser beam; and
directing a cutting laser beam along the coating removal pattern and separating the substrate into at least two coated parts.