CPC B23K 26/402 (2013.01) [B23K 26/0624 (2015.10); B23K 26/0738 (2013.01); B23K 26/082 (2015.10); B23K 26/142 (2015.10); B23K 26/18 (2013.01); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B26F 3/002 (2013.01); B26F 3/06 (2013.01); C03B 33/074 (2013.01); C03B 33/091 (2013.01); C03C 17/32 (2013.01); B23K 2101/34 (2018.08); B23K 2103/172 (2018.08); B23K 2103/42 (2018.08); B23K 2103/54 (2018.08); C03C 2218/328 (2013.01)] | 22 Claims |
1. A method for laser preparation and laser cutting of a coated substrate, the method comprising:
substantially removing a target portion of a polymer coating from a substrate to form a coating removal pattern by directing an ablative laser beam to the target portion,
wherein the target portion of the polymer coating has a width between about 100 nm and about 4.0 mm,
wherein the ablative laser beam has a wavelength that is absorbed by the polymer coating, and
wherein the substrate comprises a material transparent to the wavelength of the ablative laser beam; and
directing a cutting laser beam along the coating removal pattern and separating the substrate into at least two coated parts.
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