US D1,062,469 S
Packaging
A Reum Lee, Anyang-si (KR); and Hyun A Lee, Seongnam-si (KR)
Assigned to ORION CORPORATION, Seoul (KR)
Filed by ORION CORPORATION, Seoul (KR)
Filed on Feb. 14, 2023, as Appl. No. 29/884,616.
Term of patent 15 Years
LOC (15) Cl. 09 - 05
U.S. Cl. D 9—707
OG exemplary drawing
 
The ornamental design for a packaging as shown and described.