US 12,232,373 B2
Display substrate with transition area and manufacturing method thereof, and display apparatus
Taoran Zhang, Beijing (CN); Da Zhou, Beijing (CN); and Wenjun Liao, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/299,317
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Oct. 29, 2020, PCT No. PCT/CN2020/124931
§ 371(c)(1), (2) Date Jun. 3, 2021,
PCT Pub. No. WO2021/098475, PCT Pub. Date May 27, 2021.
Claims priority of application No. 201911133333.0 (CN), filed on Nov. 19, 2019.
Prior Publication US 2022/0059639 A1, Feb. 24, 2022
Int. Cl. H10K 59/131 (2023.01); H10K 59/12 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 59/1201 (2023.02)] 13 Claims
OG exemplary drawing
 
1. A display substrate, comprising:
a display area, a bending area, and a first transition area between the display area and the bending area;
wherein the display area is disposed with a signal line layer, the bending area is disposed with a first lead layer, the first transition area is disposed with a first connection layer, and the first connection layer is disposed with a first step formed of at least one inorganic insulating layer; and
the signal line layer is electrically connected with the first connection layer through a first via hole opened in the first step, and the first lead layer is electrically connected with the first connection layer,
wherein the display substrate further comprises a second transition area and a peripheral area, and the second transition area is located between the bending area and the peripheral area;
the peripheral area is disposed with a second lead layer, the second transition area is disposed with a second connection layer, and the second connection layer is disposed with a second step formed of at least one inorganic insulating layer;
the second lead layer is electrically connected with the second connection layer through a third via hole opened in the second step, and the first lead layer is electrically connected with the second connection layer.