| CPC H10K 50/84 (2023.02) [G02F 1/133305 (2013.01); B32B 7/12 (2013.01); B32B 2307/50 (2013.01); B32B 2307/51 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/20 (2013.01); G02F 2202/28 (2013.01)] | 16 Claims |

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1. A display device, comprising:
a curved cover plate, an optical adhesive layer, and a display module that are sequentially disposed in a thickness direction thereof, wherein:
the display module comprises a curved surface region, the curved surface region being curved in at least two intersecting directions to form a spherical surface;
the curved surface region comprises a first sub-area and a second sub-area, the second sub-area being located on a side of the first sub-area away from a center of curvature of the spherical surface;
the second sub-area is wavy in the thickness direction, the wavy second sub-area comprising a plurality of arc-shaped structures, and protruding directions of adjacent arc-shaped structures being opposite to each other; and
the optical adhesive layer is completely attached to each of the arc-shaped structures,
wherein the display module comprises a display panel and a back film, the display panel is attached to the curved cover plate via the optical adhesive layer, and the back film is disposed on a side of the display panel away from the curved cover plate, and the display panel comprises a polyimide (PI) substrate, a thin film transistor (TFT) array driving layer, and an organic light emitting diode (OLED) light-emitting layer, and a packaging film layer,
wherein the second sub-area comprising the PI substrate, the TFT array driving layer, the OLED light-emitting layer and the packaging film layer as a whole has incompressible characteristics, and the second sub-area comprising the PI substrate, the TFT array driving layer, the OLED light-emitting layer and the packaging film layer is formed into wavy folds due to its incompressibility, and
wherein a Young's modulus of the display panel comprising the PI substrate, the TFT array driving layer, the OLED light-emitting layer and the packaging film layer is 0.1 GPa to 10 GPa, and a Young's modulus of the back film is 0.1 GPa to 1 GPa.
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