US 12,232,332 B2
Integrated sensing and machine learning processing devices
Minxian Zhang, Amherst, MA (US); and Ning Ge, Danville, CA (US)
Assigned to TetraMem Inc., Fremont, CA (US)
Filed by TetraMem Inc., Fremont, CA (US)
Filed on Nov. 2, 2022, as Appl. No. 18/052,071.
Application 18/052,071 is a continuation in part of application No. 17/932,432, filed on Sep. 15, 2022.
Prior Publication US 2024/0099023 A1, Mar. 21, 2024
Int. Cl. H10B 63/00 (2023.01); H04N 23/80 (2023.01); H04N 25/78 (2023.01)
CPC H10B 63/30 (2023.02) [H04N 23/80 (2023.01); H04N 25/78 (2023.01); H10B 63/80 (2023.02)] 19 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a sensing module configured to generate a plurality of analog sensing signals; and
a machine learning (ML) processor, comprising:
one or more crossbar arrays configured to process the analog sensing signals to generate analog preprocessed sensing data;
an analog-to-digital converter (ADC) configured to convert the analog preprocessed sensing data into digital preprocessed sensing data; and
a machine learning processing unit configured to process the digital preprocessed sensing data utilizing one or more machine learning models, wherein the sensing module and the ML processor are fabricated on a single wafer, wherein the sensing module is fabricated on a first portion of the wafer, and wherein the ML processor is fabricated on a second portion of the wafer that surrounds the first portion of the wafer.