US 12,232,314 B2
Methods of forming a staircase structure
Rohit Kothari, Boise, ID (US); Jason C. McFarland, Boise, ID (US); Jason Reece, Boise, ID (US); David A. Kewley, Boise, ID (US); and Adam L. Olson, Boise, ID (US)
Assigned to Lodestar Licensing Group LLC, Evanston, IL (US)
Filed by Lodestar Licensing Group LLC, Evanston, IL (US)
Filed on Jun. 12, 2023, as Appl. No. 18/332,919.
Application 18/332,919 is a continuation of application No. 17/173,405, filed on Feb. 11, 2021, granted, now 11,678,481.
Application 17/173,405 is a continuation of application No. 16/531,815, filed on Aug. 5, 2019, granted, now 10,930,659, issued on Feb. 23, 2021.
Application 16/531,815 is a continuation of application No. 15/624,422, filed on Jun. 15, 2017, granted, now 10,600,796, issued on Mar. 24, 2020.
Prior Publication US 2023/0354595 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H10B 41/27 (2023.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); G03F 7/00 (2006.01); H10B 43/27 (2023.01)
CPC H10B 41/27 (2023.02) [H01L 21/31144 (2013.01); H01L 21/32139 (2013.01); G03F 7/0035 (2013.01); H10B 43/27 (2023.02)] 18 Claims
OG exemplary drawing
 
1. A method of forming a staircase structure, comprising:
forming tiers of alternating conductive structures and insulating structures;
removing portions of the tiers to form a slot in a peripheral region of the alternating conductive structures and insulating structures, the slot extending vertically through the tiers in the peripheral region;
removing portions of one of the conductive structures or the insulating structures in the peripheral region laterally adjacent to the slot without removing portions of another of the conductive structures or the insulating structures in the peripheral region laterally adjacent to the slot; and
forming a fill material within the slot.