CPC H10B 41/20 (2023.02) [H10B 41/10 (2023.02); H10B 41/35 (2023.02); H10B 43/10 (2023.02); H10B 43/20 (2023.02); H10B 43/35 (2023.02)] | 20 Claims |
1. A three-dimensional (3D) memory device, comprising:
a memory array structure comprising a first memory array structure and a second memory array structure;
a staircase structure between the first memory array structure and the second memory array structure in a first lateral direction, the staircase structure comprising a first staircase zone and a second staircase zone; and
a first bridge structure between the first staircase zone and the second staircase zone in a second lateral direction perpendicular to the first lateral direction, the first bridge structure having a first top surface that is nominally flat;
a second bridge structure between the first staircase zone and the second staircase zone in the second lateral direction, the second bridge structure having a second top surface that is nominally flat,
wherein the first bridge structure and the second bridge structure are separated by a gate line slit structure,
wherein each of the first staircase zone and the second staircase zone comprises:
first sub-staircases and second sub-staircases arranged alternately, each of the first sub-staircases comprising ascending stairs at different depths, each of the second sub-staircases comprising descending stairs at different depths; and
at least one stair in each of the first sub-staircases and the second sub-staircases is connected to the first memory array structure and the second memory array structure through the at least one of the first bridge structure and the second bridge structure.
|