| CPC H05K 7/209 (2013.01) [H01L 23/3107 (2013.01); H01L 25/16 (2013.01)] | 16 Claims |
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1. An electronic module assembly, comprising:
a thermally conductive material formed as a one-piece integral member;
a carrier substrate comprising a first plurality of external surfaces, wherein at least one of the first plurality of external surfaces is at least partially in contact with the thermally conductive material;
a circuit substrate mounted to the carrier substrate, wherein the circuit substrate comprises a second plurality of external surfaces, wherein at least one of the second plurality of external surfaces is at least partially in contact with the thermally conductive material, wherein the circuit substrate comprises at least one active component configured to conduct a current, and wherein the at least one active component is electrically coupled to the carrier substrate and is configured to produce heat while conducting the current; and
a passive component electrically coupled to the at least one active component and configured to conduct the current, wherein the passive component is mounted to at least one of the carrier substrate or the circuit substrate, and wherein the passive component comprises a third plurality of external surfaces, wherein at least one of the third plurality of external surfaces is at least partially in contact with the thermally conductive material,
wherein the passive component is arranged relative to the circuit substrate to form at least one gap between at least one of the second plurality of external surfaces and at least one of the third plurality of external surfaces,
wherein the thermally conductive material is integrally formed as a coating on the first plurality of external surfaces, the second plurality of external surfaces, and the third plurality of external surfaces, and integrally formed with the coating as the one-piece integral member to at least partially fill the at least one gap, and
wherein the thermally conductive material is configured to establish at least one thermal conduit that is configured to transport the heat away from the at least one active component toward a periphery of the electronic module assembly.
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