US 12,232,300 B2
Power semiconductor device and method for manufacturing power semiconductor device
Noriyuki Besshi, Tokyo (JP); Ryuichi Ishii, Tokyo (JP); Masaru Fuku, Tokyo (JP); and Kazuya Fukuhara, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 16/475,287
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Nov. 30, 2017, PCT No. PCT/JP2017/043029
§ 371(c)(1), (2) Date Jul. 1, 2019,
PCT Pub. No. WO2018/131310, PCT Pub. Date Jul. 19, 2018.
Claims priority of application No. 2017-004447 (JP), filed on Jan. 13, 2017.
Prior Publication US 2019/0343015 A1, Nov. 7, 2019
Int. Cl. H05K 7/20 (2006.01); H01L 23/28 (2006.01); H01L 23/32 (2006.01); H01L 23/36 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2023.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01)
CPC H05K 7/205 (2013.01) [H01L 23/28 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 1/021 (2013.01); H05K 3/306 (2013.01); H05K 3/34 (2013.01); H05K 13/04 (2013.01); H01L 23/32 (2013.01); H01L 23/36 (2013.01); H01L 25/115 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A power semiconductor device, comprising:
a plurality of types of power modules, to which control terminals are mounted;
a heat sink, on which the plurality of types of power modules are mounted; and
a control substrate having fixing portions, to which the control terminals are fixed, formed thereon,
wherein the heat sink has a first surface and a second surface facing each other at an outermost edge of heat sink,
wherein the plurality of types of power modules each include a columnar first protruding portion and a second protruding portion, the columnar first protruding portion being provided in an end portion of a corresponding one of the plurality of types of power modules on a side thereof on which corresponding control terminals are mounted, the second protruding portion being provided in an end portion of the corresponding one of the plurality of types of power modules on an opposite side thereof from the end portion in which the columnar first protruding portion is provided,
wherein a positional relationship between the columnar first protruding portion and the second protruding portion varies from one type of power module of the plurality of types of power modules to another type of power module of the plurality of types of power modules,
wherein the heat sink has a cylindrical first recessed portion corresponding to the columnar first protruding portion, the first recessed portion provided proximate to the first surface of the heat sink and
an elongated-hole-shaped second recessed portion corresponding to the second protruding portion, the second recessed portion provided distal to the first surface of the heat sink,
wherein the plurality of types of power modules are each mounted on the heat sink so that the columnar first protruding portion is inserted into the cylindrical first recessed portion and the second protruding portion is inserted into the elongated-hole-shaped second recessed portion,
wherein a distance from the first surface to the first recessed portion is smaller than a distance from the first surface to the second recessed portion, and the distance from the first surface to the first recessed portion is smaller than a distance from the second surface to the second recessed portion, and
wherein a positional relationship of the columnar first protruding portion relative to a corner of the corresponding power module closest to the columnar first protruding portion and a positional relationship of the second protruding portion relative to a corner of the corresponding power module closest to the second protruding portion varies from one type of power module of the plurality of types of power modules to another type of power module of the plurality of types of power modules.