US 12,232,299 B2
Methods and apparatus for cooling a substrate support
Robert Irwin Decottignies, San Carlos, CA (US); Roger Bradford Fish, Bedford, MA (US); Steven Szudarski, Pocatello, ID (US); and Shane Lawrence Kintner, Santa Clara, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 12, 2022, as Appl. No. 17/964,668.
Prior Publication US 2024/0130082 A1, Apr. 18, 2024
Int. Cl. H05K 7/20 (2006.01); H01L 21/67 (2006.01)
CPC H05K 7/20318 (2013.01) [H01L 21/67109 (2013.01); H05K 7/20372 (2013.01); H05K 7/20409 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, comprising:
a process chamber configured to process a substrate;
a substrate support comprising a heat sink configured to cool the substrate support during operation and a water trap panel comprising a pumping ring configured to cool the water trap panel such that the water trap panel condenses water vapor molecules and drops a process chamber pressure during operation; and
a chiller operably coupled to the substrate support and configured to supply a cooling fluid to the substrate support via a cooling fluid line that connects to the heat sink and the pumping ring via a serial configuration or a parallel configuration.