US 12,232,298 B2
Systems and methods for cooling of superconducting power transmission lines
Stephen Paul Ashworth, Gallicano (IT); Franco Moriconi, Berkeley, CA (US); and Timothy David Heidel, Alexandria, VA (US)
Assigned to VEIR, Inc., Woburn, MA (US)
Filed by VEIR, Inc., Boston, MA (US)
Filed on Nov. 21, 2022, as Appl. No. 17/991,758.
Application 17/991,758 is a continuation of application No. 17/742,708, filed on May 12, 2022, granted, now 11,540,419.
Application 17/742,708 is a continuation of application No. 17/524,262, filed on Nov. 11, 2021, granted, now 11,363,741, issued on Jun. 14, 2022.
Claims priority of provisional application 63/115,226, filed on Nov. 18, 2020.
Prior Publication US 2023/0269907 A1, Aug. 24, 2023
Int. Cl. H05K 7/20 (2006.01); B60H 1/32 (2006.01); H01B 7/42 (2006.01)
CPC H05K 7/20309 (2013.01) [B60H 1/3202 (2013.01); H01B 7/423 (2013.01); H05K 7/20327 (2013.01); H05K 7/20381 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method, comprising:
causing a subcooled liquid to flow through a conduit, the subcooled liquid at a pressure greater than atmospheric pressure within the conduit;
diverting a portion of the subcooled liquid into an evaporation vessel, the evaporation vessel at a lower pressure than the conduit such that the portion of the subcooled liquid diverted into the evaporation vessel from the conduit boils upon being diverted from the conduit to the evaporation vessel, the portion of the subcooled liquid diverted from the conduit into the evaporation vessel throttled based on a measurement of a level of boiling liquid in the evaporation vessel;
exposing subcooled liquid remaining in the conduit after diverting the portion of the subcooled liquid into the evaporation vessel to a heat transfer interface while exposing the boiling liquid to the heat transfer interface; and
transferring heat from the subcooled liquid remaining in the conduit to the boiling liquid via the heat transfer interface to reduce the temperature of the subcooled liquid remaining in the conduit.