US 12,232,297 B2
Cooling device
Yoshihisa Kitamura, Kyoto (JP); Naoyuki Takashima, Kyoto (JP); Takehito Tamaoka, Kyoto (JP); and Toshihiko Tokeshi, Kyoto (JP)
Assigned to NIDEC CORPORATION, Kyoto (JP)
Filed by Nidec Corporation, Kyoto (JP)
Filed on Jan. 24, 2023, as Appl. No. 18/100,581.
Claims priority of application No. 2022-013794 (JP), filed on Jan. 31, 2022; and application No. 2022-038527 (JP), filed on Mar. 11, 2022.
Prior Publication US 2023/0247792 A1, Aug. 3, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 7/20254 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A cooling device comprising:
a first cooling section;
a second cooling section;
a first pump section;
a second pump section;
a branch section to branch a refrigerant into two;
a first flow path section that connects the first cooling section and the first pump section, and through which one portion of the refrigerant that has been branched passes;
a second flow path section that connects the second cooling section and the second pump section, and through which another portion of the refrigerant that has been branched passes;
a merging section to merge the refrigerant having passed through each of the first flow path section and the second flow path section; and
a connection section to fluidly connect the first flow path section and the second flow path section between the branch section and the merging section.